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E Beam Evaporation Systems

Our newly designed family of coaters offer solutions to processing requirements that range from small scale R&D or preproduction applications to large scale, high volume production fabrication lines. Ideal for either lift off or step coverage processes, these cleanroom compatible systems accept a multitude of accessories to meet almost any requirement.

In addition, our coaters are designed to optimize flexibility and efficiency in installation as well as operation. Fully automated processing via the Temescal control system maximizes throughput as well as ease of use. The PLC Based TCS provides fully integrated process and vacuum control, recipe driven pump to vent processing with datalogging, and automated pump, vent, and regeneration cycles that run independently of recipe processing.
Temescal BJD-2000

Temescal BJD-2000

The BJD-2000 & FC-2000 are our latest PVD tools for small production or R&D. These flexible evaporation systems accept a multitude of accessories to meet almost any requirement. The BJD-2000 is identical to the FC-2000 but without the load lock feature. Engineered for efficient operation, these cleanroom compatible systems combine maximum flexibility with ease of use.
Temescal FC-2000

Temescal FC-2000

The BJD-2000 & FC-2000 are our latest PVD tools for small production or R&D. These flexible evaporation systems accept a multitude of accessories to meet almost any requirement. The FC-2000 is a fast cycle, load locked system that allows the source chamber to remain under vacuum at all times while loading substrates in & out of an isolated (bell jar type) product chamber. Engineered for efficient operation, these cleanroom compatible systems combine maximum flexibility with ease of use.
Temescal BCD-2800

Temescal BCD-2800

The newly designed BCD-2800 provides an upgrade and improvement option for customers processing requirements formerly filled by our VES-2550 load lock evaporation system. This mid-sized system offers tooling options that support either lift off or conformal (step coverage) processes, with lift off tolling enabling the customer to process up to twenty-five 4 inch wafers in a single processing cycle.

The BCD-2800 features a box type product chamber mounted over a BJD-2000 source body and replaces the VES-2550 in our product line. This system features high throughput 16 inch cryogenic pumps mounted on the product chamber.
Temescal FC-2800

Temescal FC-2800

The newly designed FC-2800 provides an upgrade and improvement option for customers processing requirements formerly filled by our FC-2700A load lock evaporation systems. This mid-sized system offers tooling options that support either lift off or conformal (step coverage) processes, with lift off tolling enabling the customer to process up to twenty-five 4 inch wafers in a single processing cycle.

The FC-2800, an update to the FC-2700, provides improved installation flexibility. This system features high throughput 16 inch cryogenic pumps mounted on the product chamber. The FC-2800 offers load lock isolation of the product and source chambers and an additional 8 inch cryo pump that keeps the source chamber at high vacuum during wafer loading and unloading.
Temescal FC-3800

Temescal FC-3800

The FC-3800, our latest large-scale evaporator, enables rapid processing of 6 inch diameter wafers for lift off and/or step coverage applications. In each load, this load lock system can coat twenty-five 6 inch diameter wafers for lift off or thirty-six 6 inch wafers for step coverage. The 38 inch x38 inch x 28 inch box type product chamber is pumped by a high throughput 16 inch cyro pump. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of dedicated 10 inch cryo pump.
Temescal FC-4400A

Temescal FC-4400A

The FC-4400A represents our largest scale design lift off oriented evaporation and our ultimate high throughput platform. This system is designed to support the metallization of thirty 6 inch wafers per load via high capacity e-beam evaporation. The load locked, 44 inch x 44 inch x 28 inch product chamber can be pumped by as many as two dedicated, high throughput 16 inch cryogenic pumps. The dual-cryo pump option makes it possible to pump this large chamber in 15 minutes from atmosphere to pressures in the range of 10E-7. During wafer exchanges, the source chamber is maintained at high vacuum by the independent pumping of a dedicated 10 inch cryo pump.


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